MECHANIC XG-Z40 Liquid Solder Soldering Paste 10cc SMD BGA SMT Stencil + Plunger

This is perfect for Mobile Phones, Laptops, Gaming Consoles BGA SMT applications. No-clean & Clear Residue Solder Paste. Excellent Wetting Compatibility. Quality of solder paste, excellent wetting, high reliability. Can effectively prevent the collapse of the printing and preheat, Tack lasting, easy to dry, sticky time for more than 48 hours.

• Uses:Adapted to the mobile phone repair industry, computer digital service industries,
  High-precision circuit board soldering SMT, BGA soldering processes, etc.
• A colorless transparent, does not affect the test, fine-clean and cleaning performance.
• Products wetting, anti-dry and strong, long shelf life at room temperature
• Type : XG-Z40, 
• Alloy : Sn63/Pb37, 
• Microns : 25-45um
• Volume : 10cc